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How to insert a VIA into a package? [message #171644] Tue, 12 September 2017 12:41
Messages: 563
Registered: March 2013
Senior Member
I need to place some VIAs for thermal conduction to the bottom layer. In the "Layer List" I can access the VIA layer, but there is no tool to place VIAs, only PADs. There is no way to change the PAD layer later, to move it to the VIA layer.Technically a PAD would do the same thing, but it will follow the PAD DRC, not the VIA. Also it will require connections in the device definition. Is it possible to add true VIAs to the package? // Max
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