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Unable to see the copper pour on the PAD though the thermels is off [message #170769] Fri, 16 June 2017 16:41 Go to next message
Siddharth Taunk
Messages: 4
Registered: June 2017
Junior Member
Hi,

I am designing a power supply PCB I have a polygon covering the PAD of one of the ICs There are several small PADS and a big PAD. Now when polygon on the top of the small pads and have the thermals off I see that the polygon fills only the small PADS completely but there is a problem with the large PAD.

How do I resolve this.
Here is the picture for the same


Thanks and regards.
Siddharth
[Capt.JPG]

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Re: Unable to see the copper pour on the PAD though the thermels is off [message #170770 is a reply to message #170769] Fri, 16 June 2017 18:13 Go to previous messageGo to next message
Jason Judson
Messages: 4
Registered: June 2017
Junior Member
Look at the Isolate setting on the polygon. I have had it set so high that it wont even make a connection to a pin.

I would also check the layout of the pad itself. There is a check box for thermals there too.

-Jason

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Re: Unable to see the copper pour on the PAD though the thermels is off [message #170786 is a reply to message #170770] Sun, 18 June 2017 11:17 Go to previous messageGo to next message
Siddharth Taunk
Messages: 4
Registered: June 2017
Junior Member
Hi,

Thanks for the response.
I got the reason behind those polygons not filling the complete area near the PADS. the reason being the "Dimensions". Due to that dimensions lines It is only allowing the trace not the polygons to fill. How do I overcome from this?

Thanks and regards.
Siddharth

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Re: Unable to see the copper pour on the PAD though the thermels is off [message #170787 is a reply to message #170770] Sun, 18 June 2017 11:19 Go to previous messageGo to next message
Siddharth Taunk
Messages: 4
Registered: June 2017
Junior Member
I have one more thing to add.

When I have that perticulaer component on the TOP SIDE why is that it is effecting the PCB on the BOTTOM

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Re: Unable to see the copper pour on the PAD though the thermels is off [message #170788 is a reply to message #170787] Sun, 18 June 2017 11:29 Go to previous messageGo to next message
Rob Pearce
Messages: 484
Registered: September 2012
Senior Member
On 18/06/17 12:19, Siddharth Taunk wrote:
> I have one more thing to add.
>
> When I have that perticulaer component on the TOP SIDE why is that it is effecting the PCB on the BOTTOM
>
You answered that in you previous post. The problem you have is with
objects in the DIMENSION layer. This layer represents edges of the
board, which clearly affects ALL layers.

Why have you got anything in the dimension layer in your component?
Re: Unable to see the copper pour on the PAD though the thermels is off [message #170789 is a reply to message #170788] Sun, 18 June 2017 11:37 Go to previous messageGo to next message
Siddharth Taunk
Messages: 4
Registered: June 2017
Junior Member
Hi,

Thank you, My bad, I designed the component thinking about the dimension of the particular component, Should I change it to tPlace?
Siddharth

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Re: Unable to see the copper pour on the PAD though the thermels is off [message #170790 is a reply to message #170789] Sun, 18 June 2017 21:16 Go to previous message
Rob Pearce
Messages: 484
Registered: September 2012
Senior Member
On 18/06/17 12:37, Siddharth Taunk wrote:
> Hi,
>
> Thank you, My bad, I designed the component thinking about the dimension of the particular component, Should I change it to tPlace?
> Siddharth
>
tPlace is probably the layer you intended, yes. It's used for the
silkscreen. There's also tDocu for additional outline segments that you
don't want on the silkscreen (e.g. because they overlap pads)
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